UVLED cured light sources are widely used in the microelectronics industry

The general UVLED light source curing area is close to zero temperature rise and no electromagnetic radiation (EMC), low overall cost, compact design, simple to use, economical and durable, multi-functional and other features are particularly suitable for some EMC and temperature sensitive components curing, for example
head, mobile phone components, semiconductor chips, etc. Consumption of energy is very small, generally no pole lamp, power in a few KW and other requirements, and uvled curing light source only a few tens of watts, fully play energy-saving and environmental protection UV curing characteristics, so it can be widely used in the microelectronics industry..
1. Mobile phone component assembly (camera lens, handset, microphone, housing, LCD module, touch screen coating, etc.)

2. Hard drive head assembly (gold wire fixing, bearings, coils, chip bonding, etc.)

3. DVD/digital camera (lens, lens bonding, board reinforcement)

4. Motor and component assembly (wire, coil fixation, coil end fixing, PTC/NTC component bonding, protection transformer core)

5. Semiconductor chip (anti-humidity protective coating, crystal mask, crystal pollution inspection, exposure of ultraviolet tape, crystal polishing inspection)

6. Sensor production (gas sensors, photoelectric sensors, fiber optic sensors, photoelectric encoders, etc.)

7. Passive devices (wave division complexer WDM, array grating wave guide AWG, optical splitter SPLITTER, optical isolator ISOLATOR, optocoupler COUPLOR, etc.), various glass package structure bonding or potting, fixing of small components, etc.

8. Active devices (coaxial devices TOSA/ROSA/BOSA, VCSEL, laser 66ers, etc.) especially FFTX low-cost miniaturized plastic package structure

9. Fiber optic cable (outer coating, marking, bonding, fiber optic gyroscope)

10. Polymer chemistry (nano-coats, photo-curing resins, photosensitive agents, monosomes, UV inks, etc.)